Hebbian theory is a neuropsychological theory claiming that an increase in synaptic efficacy arises from a presynaptic cell's repeated and persistent stimulation of a postsynaptic cell. It is an attempt to explain synaptic plasticity, the adaptation of neurons during the learning process. Hebbian theory was introduced by Donald Hebb in his 1949 book The Organization of Behavior. The theory is also called Hebb's rule, Hebb's law, Hebb's postulate, and cell assembly theory. Hebb states it as follows: Let us assume that the persistence or repetition of a reverberatory activity (or "trace") tends to induce lasting cellular changes that add to its stability. ... When an axon of cell A is near enough to excite a cell B and repeatedly or persistently takes part in firing it, some growth process or metabolic change takes place in one or both cells such that A's efficiency, as one of the cells firing B, is increased. The theory is often summarized as "Neurons that fire together, wire together." However, Hebb emphasized that cell A needs to "take part in firing" cell B, and such causality can occur only if cell A fires just before, not at the same time as, cell B. This aspect of causation in Hebb's work foreshadowed what is now known about spike-timing-dependent plasticity, which requires temporal precedence. Hebbian theory attempts to explain associative or Hebbian learning, in which simultaneous activation of cells leads to pronounced increases in synaptic strength between those cells. It also provides a biological basis for errorless learning methods for education and memory rehabilitation. In the study of neural networks in cognitive function, it is often regarded as the neuronal basis of unsupervised learning. == Engrams, cell assembly theory, and learning == Hebbian theory provides an explanation for how neurons might connect to become engrams, which may be stored in overlapping cell assemblies, or groups of neurons that encode specific information. Initially created as a way to explain recurrent activity in specific groups of cortical neurons, Hebb's theories on the form and function of cell assemblies can be understood from the following: The general idea is an old one, that any two cells or systems of cells that are repeatedly active at the same time will tend to become 'associated' so that activity in one facilitates activity in the other. Hebb also wrote: When one cell repeatedly assists in firing another, the axon of the first cell develops synaptic knobs (or enlarges them if they already exist) in contact with the soma of the second cell. D. Alan Allport posits additional ideas regarding cell assembly theory and its role in forming engrams using the concept of auto-association, or the brain's ability to retrieve information based on a partial cue, described as follows: If the inputs to a system cause the same pattern of activity to occur repeatedly, the set of active elements constituting that pattern will become increasingly strongly inter-associated. That is, each element will tend to turn on every other element and (with negative weights) to turn off the elements that do not form part of the pattern. To put it another way, the pattern as a whole will become 'auto-associated'. We may call a learned (auto-associated) pattern an engram. Research conducted in the laboratory of Nobel laureate Eric Kandel has provided evidence supporting the role of Hebbian learning mechanisms at synapses in the marine gastropod Aplysia californica. Because synapses in the peripheral nervous system of marine invertebrates are much easier to control in experiments, Kandel's research found that Hebbian long-term potentiation along with activity-dependent presynaptic facilitation are both necessary for synaptic plasticity and classical conditioning in Aplysia californica. While research on invertebrates has established fundamental mechanisms of learning and memory, much of the work on long-lasting synaptic changes between vertebrate neurons involves the use of non-physiological experimental stimulation of brain cells. However, some of the physiologically relevant synapse modification mechanisms that have been studied in vertebrate brains do seem to be examples of Hebbian processes. One such review indicates that long-lasting changes in synaptic strengths can be induced by physiologically relevant synaptic activity using both Hebbian and non-Hebbian mechanisms. == Principles == In artificial neurons and artificial neural networks, Hebb's principle can be described as a method of determining how to alter the weights between model neurons. The weight between two neurons increases if the two neurons activate simultaneously, and reduces if they activate separately. Nodes that tend to be either both positive or both negative at the same time have strong positive weights, while those that tend to be opposite have strong negative weights. The following is a formulaic description of Hebbian learning (many other descriptions are possible): w i j = x i x j , {\displaystyle \,w_{ij}=x_{i}x_{j},} where w i j {\displaystyle w_{ij}} is the weight of the connection from neuron j {\displaystyle j} to neuron i {\displaystyle i} , and x i {\displaystyle x_{i}} is the input for neuron i {\displaystyle i} . This is an example of pattern learning, where weights are updated after every training example. In a Hopfield network, connections w i j {\displaystyle w_{ij}} are set to zero if i = j {\displaystyle i=j} (no reflexive connections allowed). With binary neurons (activations either 0 or 1), connections would be set to 1 if the connected neurons have the same activation for a pattern. When several training patterns are used, the expression becomes an average of the individuals: w i j = 1 p ∑ k = 1 p x i k x j k , {\displaystyle w_{ij}={\frac {1}{p}}\sum _{k=1}^{p}x_{i}^{k}x_{j}^{k},} where w i j {\displaystyle w_{ij}} is the weight of the connection from neuron j {\displaystyle j} to neuron i {\displaystyle i} , p {\displaystyle p} is the number of training patterns and x i k {\displaystyle x_{i}^{k}} the k {\displaystyle k} -th input for neuron i {\displaystyle i} . This is learning by epoch, with weights updated after all the training examples are presented and is last term applicable to both discrete and continuous training sets. Again, in a Hopfield network, connections w i j {\displaystyle w_{ij}} are set to zero if i = j {\displaystyle i=j} (no reflexive connections). A variation of Hebbian learning that takes into account phenomena such as blocking and other neural learning phenomena is the mathematical model of Harry Klopf. Klopf's model assumes that parts of a system with simple adaptive mechanisms can underlie more complex systems with more advanced adaptive behavior, such as neural networks. == Relationship to unsupervised learning, stability, and generalization == Because of the simple nature of Hebbian learning, based only on the coincidence of pre- and post-synaptic activity, it may not be intuitively clear why this form of plasticity leads to meaningful learning. However, it can be shown that Hebbian plasticity does pick up the statistical properties of the input in a way that can be categorized as unsupervised learning. This can be mathematically shown in a simplified example. Let us work under the simplifying assumption of a single rate-based neuron of rate y ( t ) {\displaystyle y(t)} , whose inputs have rates x 1 ( t ) . . . x N ( t ) {\displaystyle x_{1}(t)...x_{N}(t)} . The response of the neuron y ( t ) {\displaystyle y(t)} is usually described as a linear combination of its input, ∑ i w i x i {\displaystyle \sum _{i}w_{i}x_{i}} , followed by a response function f {\displaystyle f} : y = f ( ∑ i = 1 N w i x i ) . {\displaystyle y=f\left(\sum _{i=1}^{N}w_{i}x_{i}\right).} As defined in the previous sections, Hebbian plasticity describes the evolution in time of the synaptic weight w {\displaystyle w} : d w i d t = η x i y . {\displaystyle {\frac {dw_{i}}{dt}}=\eta x_{i}y.} Assuming, for simplicity, an identity response function f ( a ) = a {\displaystyle f(a)=a} , we can write d w i d t = η x i ∑ j = 1 N w j x j {\displaystyle {\frac {dw_{i}}{dt}}=\eta x_{i}\sum _{j=1}^{N}w_{j}x_{j}} or in matrix form: d w d t = η x x T w . {\displaystyle {\frac {d\mathbf {w} }{dt}}=\eta \mathbf {x} \mathbf {x} ^{T}\mathbf {w} .} As in the previous chapter, if training by epoch is done an average ⟨ … ⟩ {\displaystyle \langle \dots \rangle } over discrete or continuous (time) training set of x {\displaystyle \mathbf {x} } can be done: d w d t = ⟨ η x x T w ⟩ = η ⟨ x x T ⟩ w = η C w . {\displaystyle {\frac {d\mathbf {w} }{dt}}=\langle \eta \mathbf {x} \mathbf {x} ^{T}\mathbf {w} \rangle =\eta \langle \mathbf {x} \mathbf {x} ^{T}\rangle \mathbf {w} =\eta C\mathbf {w} .} where C = ⟨ x x T ⟩ {\displaystyle C=\langle \,\mathbf {x} \mathbf {x} ^{T}\rangle } is the correlation matrix of the input under the additional assumption that ⟨ x ⟩ = 0 {\displaystyle \langle \mathbf
List of ARM Cortex-M development tools
This is a list of development tools for 32-bit ARM Cortex-M-based microcontrollers, which consists of Cortex-M0, Cortex-M0+, Cortex-M1, Cortex-M3, Cortex-M4, Cortex-M7, Cortex-M23, Cortex-M33, Cortex-M35P, Cortex-M52, Cortex-M55, and Cortex-M85 cores. == Development toolchains == IDE, compiler, linker, debugger, flashing (in alphabetical order): Ac6 System Workbench for STM32 (based on Eclipse and the GNU GCC toolchain with direct support for all ST-provided evaluation boards, Eval, Discovery and Nucleo, debug with ST-LINK) ARM Development Studio 5 by ARM Ltd. Atmel Studio by Atmel (based on Visual Studio and GNU GCC Toolchain) Code Composer Studio by Texas Instruments CoIDE by CooCox (note - website dead since 2018) Crossware Development Suite for ARM by Crossware CrossWorks for ARM by Rowley Dave by Infineon. For XMC processors only. Includes project wizard, detailed register decoding and a code library still under development. DRT by SOMNIUM Technologies. Based on GCC toolchain and proprietary linker technology. Available as a plugin for Atmel Studio and an Eclipse-based IDE. EmBitz (formerly Em::Blocks) – free, fast (non-eclipse) IDE for ST-LINK (live data updates), OpenOCD, including GNU Tools for ARM and project wizards for ST, Atmel, EnergyMicro etc. Embeetle IDE - free, fast (non-eclipse) IDE. Works both on Linux and Windows. emIDE by emide – free Visual Studio Style IDE including GNU Tools for ARM GNU ARM Eclipse – A family of Eclipse CDT extensions and tools for GNU ARM development GNU Tools (aka GCC) for ARM Embedded Processors by ARM Ltd – free GCC for bare metal IAR Embedded Workbench for ARM by IAR Systems ICC by ImageCraft Keil MDK-ARM by Keil LPCXpresso by NXP (formerly Red Suite by Code Red Technologies) MikroC by mikroe – mikroC MULTI by Green Hills Software, for all Arm 7, 9, Cortex-M, Cortex-R, Cortex-A Ride and RKit for ARM by Raisonance SEGGER Embedded Studio for ARM by Segger. SEGGER Ozone by Segger. STM32CubeIDE by STMicroelectronics - Combines STCubeMX with TrueSTUDIO into a single Eclipse style package Sourcery CodeBench by Mentor Graphics TASKING VX-Toolset by Altium TrueSTUDIO by Atollic Visual Studio by Microsoft as IDE, with GNU Tools as compiler/linker – e.g. supported by VisualGDB VXM Design's Buildroot toolchain for Cortex. It integrates GNU toolchain, Nuttx, filesystem and debugger/flasher in one build. winIDEA/winIDEAOpen by iSYSTEM YAGARTO – free GCC (no longer supported) Code::Blocks (EPS edition) (debug with ST-LINK no GDB and no OpenOCD required) IDE for Arduino ARM boards Arduino – IDE for Atmel SAM3X (Arduino Due) Energia – Arduino IDE for Texas Instruments Tiva and CC3200 Notes: == Debugging tools == JTAG and/or SWD debug interface host adapters (in alphabetical order): Black Magic Probe by 1BitSquared. CMSIS-DAP by Mbed. Crossconnect by Rowley Associates. DSTREAM by ARM Holdings Green Hills Probe and SuperTrace Probe by Green Hills Software. iTAG by iSYSTEM. I-jet by IAR Systems. Jaguar by Crossware. J-Link by Segger Supports JTAG and SWD. Supports ARM7, ARM9, ARM11, Cortex-A, Cortex-M, Cortex-R, Renesas RX, Microchip PIC32. Eclipse plug-in available. Supports GDB, RDI, Ozone debuggers. J-Trace by Segger. Supports JTAG, SWD, and ETM trace on Cortex-M. JTAGjet by Signum. LPC-LINK by Embedded Artists (for NXP) This is only embedded on NXP LPCXpresso development boards. LPC-LINK 2 by NXP. This device can be reconfigured to support 3 different protocols: J-LINK by Segger, CMSIS-DAP by ARM, Redlink by Code Red. Multilink debug probes, Cyclone in-system programming/debugging interfaces, and a GDB Server plug-in for Eclipse-based ARM IDEs by PEmicro. OpenOCD open source GDB server supports a variety of JTAG probes OpenOCD Eclipse plug-in available in GNU ARM Eclipse Plug-ins. AK-OPENJTAG by Artekit (Open JTAG-compatible). AK-LINK by Artekit. PEEDI by RONETIX Debug Probe by Raspberry Pi. RLink by Raisonance. ST-LINK/V2 by STMicroelectronics The ST-LINK/V2 debugger embedded on STM32 Nucleo and Discovery development boards can be converted to SEGGER J-LINK protocol. TRACE32 Debugger and ETM/ITM Trace by Lauterbach. ULINK by Keil. Debugging tools and/or debugging plug-ins (in alphabetical order): Memfault Error Analysis for post mortem debugging Percepio Tracealyzer, RTOS trace visualizer (with Eclipse plugin). Segger SystemView, RTOS trace visualizer. == Real-time operating systems == Commonly referred to as RTOS: == C/C++ software libraries == The following are free C/C++ libraries: ARM Cortex libraries: Cortex Microcontroller Software Interface Standard (CMSIS) libopencm3 (formerly called libopenstm32) libmaple for STM32F1 chips LPCOpen for NXP LPC chips Alternate C standard libraries: Bionic libc, dietlibc, EGLIBC, glibc, klibc, musl, Newlib, uClibc FAT file system libraries: EFSL, FatFs, Petit FatFs Fixed-point math libraries: libfixmath, fixedptc, FPMLib Encryption libraries: Comparison of TLS implementations wolfSSL == Non-C/C++ computer languages and software libraries ==
Plug compatibility
Plug compatibility is a characteristic of computer hardware that performs exactly like that of another vendor. Manufacturers who made replacements for IBM peripherals were referred to as plug-compatible manufacturers (PCMs). Later plug-compatible mainframe (also PCM) referred to IBM-compatible mainframe computers. PCM can also mean plug-compatible machine or plug-compatible module. == Plug compatibility and peripherals == Before the rise of the plug-compatible peripheral industry, computing systems were either configured with peripherals designed and built by the CPU vendor or designed to use vendor-selected rebadged devices. The first examples of plug-compatible IBM subsystems were tape drives and controls offered by Telex beginning 1965. Memorex in 1968 was first to enter the IBM plug-compatible disk market, followed shortly thereafter by a number of suppliers such as CDC, Itel, and Storage Technology Corporation. This was boosted by the world's largest user of computing equipment, the US General Services Administration, buying plug-compatible equipment. Eventually there were third-party plug-compatible alternatives to most first-party peripherals and first-party system main memory. == Plug compatibility and computer systems == A plug-compatible machine is one that is backward compatible with a prior machine. In particular, a new computer system that is plug-compatible has not only the same connectors and protocol interfaces to peripherals, but also binary-code compatibility—it runs the same software as the old system. A plug compatible manufacturer, or PCM, is a company that makes such products. One recurring theme in plug-compatible systems is the ability to be bug compatible as well. That is, if the forerunner system had software or interface problems, then the successor must have (or simulate) the same problems. Otherwise, the new system may generate unpredictable results, defeating the objective of full compatibility. Thus, it is important for customers to understand the difference between a bug and a feature, where the latter is defined as an intentional modification to the previous system (e.g. higher speed, lighter weight, smaller package, better operator controls, etc.). === Plug compatibility and IBM mainframes === The original example of plug-compatible mainframes was the Amdahl 470 mainframe computer which was plug-compatible with the IBM System 360 and 370, costing millions of dollars to develop. Similar systems were available from Comparex, Fujitsu, and Hitachi. Not all were large systems. Most of these system vendors eventually left the PCM market. In late 1981, there were eight PCM companies, and collectively they had 36 IBM-compatible models. == Non-computer usage of plug compatibility == Plug compatibility may also be used to describe replacement criteria for other components available from multiple sources. For example, a plug-compatible cooling fan may need to have not only the same physical size and shape, but also similar capability, run from the same voltage, use similar power, attach with a standard electrical connector, and have similar mounting arrangements. Some non-conforming units may be re-packaged or modified to meet plug-compatible requirements, as where an adapter plate is provided for mounting, or a different tool and instructions are supplied for installation, and these modifications would be reflected in the bill of materials for such components. Similar issues arise for computer system interfaces when competitors wish to offer an easy upgrade path. In general, plug-compatible systems are designed where industry or de facto standards have rigorously defined the environment, and there is a large installed population of machines that can benefit from third-party enhancements. Plug compatible does not mean identical. However, nothing prevents a company from developing follow-on products that are backward-compatible with its own early products.
Digital image correlation for electronics
Digital image correlation analyses have applications in material property characterization, displacement measurement, and strain mapping. As such, DIC is becoming an increasingly popular tool when evaluating the thermo-mechanical behavior of electronic components and systems. == CTE measurements and glass transition temperature identification == The most common application of DIC in the electronics industry is the measurement of coefficient of thermal expansion (CTE). Because it is a non-contact, full-field surface technique, DIC is ideal for measuring the effective CTE of printed circuit boards (PCB) and individual surfaces of electronic components. It is especially useful for characterizing the properties of complex integrated circuits, as the combined thermal expansion effects of the substrate, molding compound, and die make effective CTE difficult to estimate at the substrate surface with other experimental methods. DIC techniques can be used to calculate average in-plane strain as a function of temperature over an area of interest during a thermal profile. Linear curve-fitting and slope calculation can then be used to estimate an effective CTE for the observed area. Because the driving factor in solder fatigue is most often the CTE mismatch between a component and the PCB it is soldered to, accurate CTE measurements are vital for calculating printed circuit board assembly (PCBA) reliability metrics. DIC is also useful for characterizing the thermal properties of polymers. Polymers are often used in electronic assemblies as potting compounds, conformal coatings, adhesives, molding compounds, dielectrics, and underfills. Because the stiffness of such materials can vary widely, accurately determining their thermal characteristics with contact techniques that transfer load to the specimen, such as dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA), is difficult to do with consistency. Accurate CTE measurements are important for these materials because, depending on the specific use case, expansion and contraction of these materials can drastically affect solder joint reliability. For example, if a stiff conformal coating or other polymeric encapsulation is allowed to flow under a QFN, its expansion and contraction during thermal cycling can add tensile stress to the solder joints and expedite fatigue failure. DIC techniques will also allow the detection of glass transition temperature (Tg). At a glass transition temperature, the strain vs. temperature plot will exhibit a change in slope. Determining the Tg is very important for polymeric materials that could have glass transition temperatures within the operating temperature range of the electronics assemblies and components on which they are used. For example, some potting materials can see the Elastic Modulus of the material change by a factor of 100 or more over the glass transition region. Such changes can have drastic effects on an electronic assembly's reliability if they are not planned for in the design process. == Out-of-plane component warpage == When 3D DIC techniques are employed, out-of-plane motion can be tracked in addition to in-plane motion. Out-of-plane warpage is especially of interest at the component level of electronics packaging for solder joint reliability quantification. Excessive warpage during reflow can contribute to defective solder joints by lifting the edges of the component away from the board and creating head-in-pillow defects in ball grid arrays (BGA). Warpage can also shorten the fatigue life of adequate joints by adding tensile stresses to edge joints during thermal cycling. == Thermo-mechanical strain mapping == When a PCBA is over-constrained, thermo-mechanical stress brought about during thermal expansion can cause board strains that could negatively affect individual component and overall assembly reliability. The full-field monitoring capabilities of an image correlation technique allow for the measurement of strain magnitude and location on the surface of a specimen during a displacement-causing event, such as PCBA during a thermal profile. These "strain maps" allow for the comparison of strain levels over full areas of interest. Many traditional discrete methods, like extensometers and strain gauges, only allow for localized measurements of strain, inhibiting their ability to efficiently measure strain across larger areas of interest. DIC techniques have also been used to generate strain maps from purely mechanical events, such as drop impact tests, on electronic assemblies.
Digital backlot
A digital backlot or virtual backlot is a motion-picture set that is neither a genuine location nor a constructed studio; the shooting takes place entirely on a stage with a blank background (often a greenscreen) that will later on project an artificial environment put in during post-production. Digital backlots are mainly used for genres such as science fiction, where building a real set would be too expensive or outright impossible. == Notable films == Among the first films to introduce the technique was Mini Moni the Movie by Shinji Higuchi in 2002, predated by Rest In Peace by Stolpskott Film (2000). Others include: === Released === Rest in Peace (Sweden, 2000) – Shot entirely with green-screen. Some sections fully CGI. Casshern (Japan, 2004) – Shot on celluloid. A few practical set pieces used. Able Edwards (United States, 2004) – Shot digitally on Canon XL1 cameras. Immortal (France, 2004) – Shot on celluloid. Also showed CGI characters interacting with live actors. Sky Captain and the World of Tomorrow (United States, 2004) – Shot digitally on Sony CineAlta cameras. Sin City (United States, 2005) – Shot digitally on CineAlta cameras. Three practical sets used. MirrorMask (United States/United Kingdom, 2005) – Shot on celluloid. 80% of film uses digital backlot. Some practical set pieces used. The Cabinet of Dr. Caligari (United States, 2005) – Shot digitally. 300 (United States, 2007) – Shot on celluloid. Two practical sets used. Speed Racer (United States, 2008) – Directed by the Wachowskis. Three practical sets used. The Spirit (United States, 2008) – Director Frank Miller shot the film with the same techniques he and Robert Rodriguez used on Sin City. Avatar (United States, 2009) – Directed by James Cameron. Two practical sets used. Goemon (Japan, 2009) – The second film from Casshern helmer Kazuaki Kiriya. Alice in Wonderland (United States, 2010) – Directed by Tim Burton. Practical sets used. Sin City: A Dame to Kill For (United States 2014) – Co-directed by Robert Rodriguez and Frank Miller. Sequel to Sin City. === Upcoming === Tribes of October
Pixelmator Pro
Pixelmator Pro is a photo, video, and vector graphic editor developed by Apple for macOS and iPadOS as part of its Pixelmator and pro apps platforms and as a part of their Apple Creator Studio suite of applications. Pixelmator Pro relies heavily on technologies from Apple platforms such as Metal, CoreML, Core Image, AVFoundation, GCD, and SwiftUI. == Features == GPU accelerated with Metal 50+ standard image editing tools Layer-based image editor Video editing support Vector graphic support (including SVG support) AI-powered editing features such as background removal ML Super Resolution and Smart Replace Supports a variety of media formats (JPEG, RAW, Apple ProRAW, PSD, PNG, GIF, MP4, HEIF, etc) == Reception == Pixelmator Pro was generally well-received by reviewers who praised its deep use of machine learning, fully macOS-native design, and relatively affordable one-time purchase compared to subscription software such as Adobe Photoshop. Some reviewers criticized that some features are hard to find or hard to use. It was awarded Apple's Mac App of the Year in 2018. Pixelmator Pro does not have support for panorama stitching. == Acquisition by Apple == On November 1, 2024, the Pixelmator Team announced that they were to be acquired by Apple, subject to regulatory approval. Their site promises "There will be no material changes to the Pixelmator Pro, Pixelmator for iOS, and Photomator apps at this time." The acquisition was completed in February 2025. On January 13, 2026, Apple announced that a new version of Pixelmator Pro with AI features would be included in its new Apple Creator Studio subscription, the app would be brought to the iPad and the Mac app would be redesigned with Liquid Glass. == Version history == == Applescript == In 2020 Pixelmator Pro added the ability to leverage Apple's automation language 'AppleScript' to automate many tasks in version 1.8 (Lynx). This enabled simple and advanced automation activities such as image resize, crop, color adjustments, format change, moving layers around, and more advanced actions like removing background, Gaussian blur, text replacement, shadows, color replacement, etc.
Hype (marketing)
Hype in marketing is a strategy of using extreme publicity. Hype as a modern marketing strategy is closely associated with social media. Marketing through hype often uses artificial scarcity to induce demand. Consumers of hyped products often participate as a form of conspicuous consumption to signify characteristics about themselves. Hype allows brands to promote their image above the actual quality of the product. Streetwear brands have collaborated with luxury fashion to justify charging premium prices for their goods. As an example, fashion label Vetements used social media channels to promote a limited-edition hoodie which sold 500 units in hours, recording sales of €445,000. When hype marketing is used to drive demand for limited-edition goods, consumers sometimes attempt resell those good on secondary markets for a profit (comparable to ticket scalping). The resale market is a $24 billion industry. == Method == Luxury brands may release products as a collaborate with ready-made garment brands as a way to build hype. Collaborations have been used by some luxury brands to circumvent fast fashion brands copying their designs. NYU Professor Adam Alter says that for an established brand to create a scarcity frenzy, they need to release a limited number of different products, frequently. Hype is often built via Pop-up retail. Comme des Garçons was one of the first to use this strategy, leasing a short-term vacant shop solved the storage problems of releasing product for quick sale. Hype campaigns also rely on influencer marketing, where brands enlist creators whose parasocial relationships with their followers help convert audience attention into demand for limited releases. == In popular culture == The term 'hypebeast' has been coined to define consumers vulnerable to hype marketing. The origins of the term come from the Hong Kong-based company Hypebeast. The behaviours of the hypebeast define hype marketing; the purchase of popular goods they can't afford to impress others. Hype also manifests itself in queues with brands often retailing hyped products through pop-up stores. Many luxury brands release hyped products via their online shop. This has led to the creation of companies that allow consumers to use bots to guarantee or improve their chances of purchasing a limited-edition product.